Phenol, 4,4′-cyclohexylidenebis[2-amino- CAS#: 30817-90-4; ChemWhat Code: 1490905
Identification
| Product Name | Phenol, 4,4′-cyclohexylidenebis[2-amino- |
| IUPAC Name | 2-amino-4-[1-(3-amino-4-hydroxyphenyl)cyclohexyl]phenol |
| Molecular Structure |  |
| CAS Registry Number | Phenol, 4,4′-cyclohexylidenebis[2-amino- CAS#: 30817-90-4 |
| EINECS Number | No data available |
| MDL Number | No data available |
| Beilstein Registry Number | No data available |
| Synonyms | 2-amino-4-[1-(3-amino-4-hydroxyphenyl)cyclohexyl]phenol Phenol, 4,4′-cyclohexylidenebis[2-amino-; 4,4′-(Cyclohexane-1,1-diyl)bis(2-aminophenol); SCHEMBL13784870; 2-amino-4-[1-(3-amino-4-hydroxyphenyl)cyclohexyl]phenol; DTXSID00458481; SY347430; 4,4 inverted exclamation mark -(Cyclohexane-1,1-diyl)bis(2-aminophenol); 2-amino-4-[1-(3-amino-4-hydroxy-phenyl)cyclohexyl]phenol; 2-azanyl-4-[1-(3-azanyl-4-oxidanyl-phenyl)cyclohexyl]phenol |
| Molecular Formula | C18H22N2O2 |
| Molecular Weight | 298.379 |
| InChI | InChI=1S/C18H22N2O2/c19-14-10-12(4-6-16(14)21)18(8-2-1-3-9-18)13-5-7-17(22)15(20)11-13/h4-7,10-11,21-22H,1-3,8-9,19-20H2 |
| InChI Key | BOVSSHUURZCDRR-UHFFFAOYSA-N |
| Canonical SMILES | Oc1ccc(cc1N)C3(c2cc(N)c(O)cc2)CCCCC3 |
| Patent Information |
| No data available |
Physical Data
| Appearance | White to off-white solid |
| Boiling Point | 518.8±50.0 °C(Predicted) |
| Boiling Point, °C |
| 251 |
| 250 – 252 |
| Density, g·cm-3 | Reference Temperature, °C | Measurement Temperature, °C |
| 1.271 |
Spectra
| No data available |
Route of Synthesis (ROS)
| No data available |
Safety and Hazards
| GHS Hazard Statements | No data available |
Other Data
| Transportation | NONH for all modes of transport |
| Under the room temperature and away from light | |
| HS Code | No data available |
| Storage | Under the room temperature and away from light |
| Shelf Life | 1 year |
| Market Price | USD |
| Use Pattern |
| Phenol, 4,4′-cyclohexylidenebis[2-amino- CAS 30817-90-4 is used as a curing agent for epoxy resins in integrated circuit (IC) packaging. It enhances the glass transition temperature (Tg) of the resin, improving its performance under high temperatures. The resulting crosslinked network provides excellent mechanical strength, protecting ICs from external stress. Its hydrophobic structure improves moisture resistance, ensuring long-term reliability of the packaging. Additionally, it helps lower the coefficient of thermal expansion (CTE), reducing the risk of interfacial failure during thermal cycling. |
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Approved Manufacturers | |
| Warshel Chemical Ltd | http://www.warshel.com/ |
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